Ta-N及Ta-C-N薄膜的制备和性能的研究

Ta-N及Ta-C-N薄膜的制备和性能的研究摘要：本文研究了Ta-N和Ta-C-N薄膜的制备和性能。通过物理气相沉积技术（PVD）制备出了不同成分的薄膜，并使用X射线衍射（XRD）、扫描电子显微镜（S

Ta-NTa-C-N 及薄膜的制备和性能的研究 摘要： Ta-NTa-C-N 本文研究了和薄膜的制备和性能。通过物理气相沉积 PVDXXRD 技术（）制备出了不同成分的薄膜，并使用射线衍射（）、扫 SEMAFM 描电子显微镜（）、原子力显微镜（）等技术对薄膜进行了表 Ta-C-N 征。研究结果表明，以碳氮气氛下制备的薄膜中，碳含量的增加 使得薄膜的晶格常数和表面粗糙度增加；而氮的掺杂则对晶格没有显著 Ta-N 影响，但对表面形貌有明显改善。在耐蚀性测试中，以薄膜更为优 Ta-C-N 越，其具有更佳的抗腐蚀性能，而薄膜具有更好的耐磨性能。因 Ta-NTa-C-N 此，本研究对深入了解和薄膜的制备和性能具有重要意 义。 Ta-NTa-C-N 关键词：薄膜，薄膜，物理气相沉积，表征 Introduction With the rapid development of technologies, the demand for high-performance coatings has become increasingly important in industries such as aerospace, automobile, and electronics. As a promising candidate, tantalum (Ta) and its compounds have attracted much attention due to their excellent physical and chemical properties, such as high melting point, corrosion resistance, and low friction coefficients (1, 2). Ta-N and Ta-C-N thin films, in particular, have been widely studied and employed for their excellent combination of wear resistance, corrosion resistance, and low friction capabilities (3). In this study, we aim to investigate the preparation and properties of Ta-N and Ta-C-N thin films. Physical vapor deposition (PVD) was used to prepare these films with different compositions, and the films were characterized using various analysis techniques, such as X-ray diffraction (XRD), scanning electron microscopy (SEM), and atomic force microscopy (AFM). The properties of the films, such as hardness, wear resistance, and corrosion resistance, were also studied. Experimental Procedure Ta-N and Ta-C-N thin films were prepared by PVD using aRF sputtering system. The base pressure of the chamber was kept below 5