形状记忆聚合物本构模型及TPI复合材料性能研究的任务书

形状记忆聚合物本构模型及TPI复合材料性能研究的任务书任务书Background:Shape memory polymers (SMPs) are an emerging class of mater

TPI 形状记忆聚合物本构模型及复合材料性能研究的 任务书 任务书 Background: Shapememorypolymers(SMPs)areanemergingclassof materialswithtremendouspotentialinvariousapplicationssuch assensors,actuators,biomedicaldevices,andaerospace components.SMPshavetheabilitytorecovertheiroriginalshape fromadeformedstatewhenexposedtospecificstimulisuchas heat,light,orelectricity.Thisuniquepropertyisattributedtothe presenceofshapememoryeffect(SME)inSMPs.Oneofthe promisingapplicationsofSMPsisinthedesignanddevelopment ofsmartmaterialswithshapememorypropertiesforcomposite structures.However,thelackofarobustconstitutivemodelfor SMPshinderstheirwidespreaduseinadvancedcomposites. Task: ThetaskistodevelopaconstitutivemodelforSMPsand investigatethethermal,mechanical,andshapememoryproperties ofthermoplasticpolyimide(TPI)compositesreinforcedwithSMP fibers. Objectives: 1.Toreviewtheliteratureonthecurrentstate-of-the-artin SMPsandtheircomposites. 2.TodevelopaconstitutivemodelforSMPsbasedon thermodynamicsandmechanicsprinciples. 3.Toinvestigatetheeffectoftemperatureanddeformation rateonthemechanicalbehaviorofSMPsusingtensile, compression,andbendingtests. 4.TomeasuretheshapememoryeffectofSMPsusing temperaturecycles,stress/straincycles,andcreeptests. 5.TofabricateTPI/SMPcompositelaminatesbyusinghot compressionmolding.