基于非局部位错密度晶体塑性有限元模型的金属晶体薄膜微弯曲变形特点(英文)

基于非局部位错密度晶体塑性有限元模型的金属晶体薄膜微弯曲变形特点(英文)Title: Deformation Characteristics of Thin Metal Films due to Mi

基于非局部位错密度晶体塑性有限元模型的金属晶体 () 薄膜微弯曲变形特点英文 Title: Deformation Characteristics of Thin Metal Films due to Micro-bending Based on aNon-local Dislocation Density Crystal Plasticity Finite Element Model Abstract: Thin metal films are widely used in various engineering applications such as microelectromechanical systems (MEMS) and flexible electronics. Understanding the deformation behavior of these films under mechanical loading is crucial for their design and reliability. In this study, we investigate the micro-bending deformation characteristics of metal films using anon-local dislocation density crystal plasticity finite element model. The aim is to provide valuable insights into the mechanical behavior of thin metal films and to help optimize their design and performance. 1. Introduction Thin metal films are commonly used in microelectronics due to their excellent electrical conductivity and mechanical properties. However, with the continuous downscaling of devices, the mechanical behavior of these films becomes increasingly important. Micro-bending-induced deformation is one of the main challenges for the reliability and performance of thin metal films. This study aims to understand the underlying deformation mechanisms and provide a comprehensive analysis of the micro-bending behavior in metal films. 2. Crystal Plasticity Models for Thin Metal Films The non-local dislocation density crystal plasticity finite element model is introduced to capture the complex deformation behavior of metal films. This model considers both the elastic and plastic deformation of the crystal lattice, as well as the evolution of dislocations. The non-local formulation accounts for the interaction of dislocations over large distances, which is crucial for capturing the size effects observed in thin films. 3. Modeling and Simulation The finite element model is developed to simulate the micro-bending deformation of thin metal films. The model incorporates