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硅超大规模集成电路工艺技术-理论实践与模型课后习题答案

1.2. Assuming dopant atoms are uniformly distributed in a silicon crystal, how far apart are these a

硅超大规模集成电路工艺技术—理论、实践与模型 课后习题答案

1.2. Assuming dopant atoms are uniformly distributed in a silicon crystal, how far apart arethese at

硅超大规模集成电路工艺技术-理论、实践与模型课后习题答案

1.2. Assuming dopant atoms are uniformly distributed in a silicon crystal, how far apart are these a

硅超大规模集成电路工艺技术-理论、实践与模型课后习题答案

1.2. Assuming dopant atoms are uniformly distributed in a silicon crystal, how far apart are these a

硅超大规模集成电路工艺技术—理论、实践与模型课后习题答案

1.2. Assuming dopant atoms are uniformly distributed in a silicon crystal, how far apart are these a

硅超大规模集成电路工艺技术—理论、实践与模型 课后习题答案

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硅超大规模集成电路工艺技术—理论、实践与模型_课后习题答案

1.2. Assuming dopant atoms are uniformly distributed in a silicon crystal, how far apart are these a

硅超大规模集成电路工艺技术金属化

微电子工艺技术第八讲 单项工艺金属膜制备-蒸发、溅射、CVD和电镀钱 鹤清华大学微纳电子系CMOS器件旁的Plug布线层数和总长度:10层布线,最细线宽在45nm左右,而布线总长度可达到5公里量级;除